Indoor Wireless to 5G: From DAS to Small Cells
Price: Starting at USD 3,000
Publish Date: 02 Oct 2018
Code: AN-2821
Research Type: Research Report
Pages: 43
As wireless systems continuously evolve to include new features, offer performance improvements and enable new use cases, the Radio Access Network (RAN) must undergo changes in architecture and topology as well as incorporate upgrades to new technologies while remaining backward compatible with existing technologies. The RAN of the future must migrate to a very high throughput, ultra-dense, multi-technology Heterogeneous Network (HetNet).
To accomplish this without increasing Total Cost of Ownership (TCO), network architects are adopting techniques such as Network Functions Virtualization (NFV), Software-Defined Networking (SDN), Multi-access Edge Computing (MEC), and changing system partitioning and modernizing fronthaul protocols to transport the very high throughput traffic levels anticipated in 5G systems.
While this holds true for outdoor mobile networks it is in the indoor space, where most mobile traffic originates, that special additional consideration must be given to overcome the challenges specific to in-building wireless.
In this report we examine the implications to the design of in-building systems which are necessary to seamlessly handle this very high throughput, ultra-dense, multi-technology HetNet. We outline existing 4G and Wi-Fi, and the upcoming 5G, OnGo and MulteFire technologies which will impact in-building wireless systems soon.
We examine in-building systems types including repeaters, small cells, Distributed Antenna Systems (DAS), Distributed Radio Systems (DRS) and discuss these systems’ architectures and topologies, spectrum and signal propagation, transport or fronthaul and antenna configurations.
Companies profiled in this report include Airspan, ADRF, Casa Systems, Cobham Wireless, Comba Telecom, CommScope, Corning, Dali Wireless, Ericsson, Huawei, ip.access, JMA Wireless, Kathrein, Mavenir, Nextivity, Nokia, Ruckus, Samsung, SOLiD Technologies, Westell Technologies, Wilson Electronics, Zinwave, and ZTE.
