ABI Research reports that Samsung, the world leader in mobile handsets, has started shipment of its internally created quad-core application processor with integrated LTE modem. The chip consists of a 1.4GHz quad-core application processor and a 2G/3G/4G modem.
Jim Mielke, VP of engineering at ABI research, comments, “We have seen a number of generations of Samsung LTE single-mode modems, and the higher marketed multi-core processors (Exynos family) but this is the first introduction of a quad-core processor with an integrated tri-mode modem (2G/3G/4G).” Samsung is only the second company to ship an application processor with an integrated LTE modem (Qualcomm being the other supplier in production). Mielke continues, “This is also the first time we have seen a complete chipset from Samsung, whereas prior chips from the company were surrounded by other suppliers for power management and RF.” The complete chipset found in the Samsung phone includes a Samsung power management unit (PMU) and a Samsung 2G/3G/4G transceiver. Other notable components found in the phone include a multi-mode/multi-band PA from TriQuint, an audio Hub from Wolfson Microelectronics, a MEMS microphone from Knowles, and Wi-Fi/BT and GPS solutions from Broadcom.
A complete teardown of the Samsung chipset and accompanying chips is available from ABI Research’s Teardown Service. The full teardown includes a complete bill of materials w/cost estimates, high resolution dismantling and board photos, performance benchmarks, current drain measurements, component die photos and X-rays.
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