Quectel the First to Market with HiSilicon and Qualcomm’s New NB-IoT Chipsets

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By Jamie Moss | 2Q 2021 | IN-6156


The 3rd Generation of NB-IoT


Quectel plans to launch the next generation of its Narrowband Internet of Things (NB-IoT) modules in May 2021, the Quectel BC95-CNV and BC28-CNV. They will be the first commercially available modules to use the Boudica 200 modem chip from HiSilicon, the semiconductor arm of Huawei. The Boudica 200 is the third and most recent NB-IoT modem chip from HiSilicon, following on from the Boudica 120 and Boudica 150 which launched in mid-2017 and early 2018, respectively. The use of the Boudica 200 brings a specific set of new features to Quectel’s NB-IoT-only product line, most importantly: Bluetooth Low Energy (BLE) 5.0, Global Navigation Satellite System (GNSS) positioning, and a reduction in power consumption over previous HiSilicon-based models by as much as 50%. The Boudica chips have been basic in terms of the features offered in the past, the only difference between the 120 and 150 chips being greater LTE band support, and multi-tone instead of single-tone for a greater throughput rate for the 150.

HiSilicon had been quiet for years on the development of new cellular low-power wid…

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