Heterogeneous AI Chipset Shipments by Device
Source Research:
Artificial Intelligence and Machine Learning: Personal & Work Devices
Heterogenous computing designs are not new—MediaTek is currently mass-producing its 7th
generation APU. However, systems that optimize and distribute workloads down to the hardware
level are novel, driven largely by demand from generative AI and other high-performance
workloads across architectures. The deployment of these heterogenous AI systems will,
therefore, become more common, and closely tracks the trajectory of generative AI deployments.
The shipment of heterogenous edge AI chipsets will begin in 2024 as the production of on-device AI
smartphones containing Snapdragon 8 Gen 3 and Dimensity 9300 begins, also influenced (albeit
with smaller shipment numbers) by Google’s mobile Tensor G3 SoC and Apple’s next iteration of
the A-Series SoCs as of their launch in 4Q. Alongside these smartphone SoCs, shipments of PCs
containing Intel’s Core Ultra processors, as well as AMD’s Ryzen 7000 and 8000 series chipsets,
will also start. The penetration of heterogenous AI systems into overall shipments increases at an
accelerating rate between 2025 and 2028 as the proliferation of generative AI picks up, and the
software ecosystem matures.
