STMicroelectronics and NXP Form Wireless Semiconductor Powerhouse
The STMicroelectronics merger with NXP is impressive on paper and welcomed at every level of the wireless ecosystem, except maybe by Qualcomm, TI, and any other wireless semiconductor company now looking up at what is likely to be the industry’s third largest player. Each of the combining organizations brings a large portfolio of wireless products to the table and the two companies have similar production approaches, insofar as neither owns or operates a wafer fabrication facility, each chooses, instead, to outsource to established foundry vendors. With a merger this size, overlaps are expected. Will there be costly overlap or will this merger capitalize on a complementary fit between these two companies?
You must be a subscriber to
Future Immersive Computing,
Smartphones and Handsets
to view the STMicroelectronics and NXP Form Wireless Semiconductor Powerhouse Insight.
To find out more about subscribing: