ABI Research Teardown: HTC Sensation Includes Qualcomm’s MSM8260, Worlds First Dual-Core Application Processor with Integrated HSPA Modem

New York, New York - July 28, 2011

A number of dual-core application processors have been launched beginning in first quarter of this year. With the MSM8260, however, Qualcomm has integrated an advanced dual-core application processor with an HSPA modem in one unit, deployed in the HTC Sensation phone. ABI Research has conducted an in-depth teardown of the MSM8260.

ABI Research vice president of engineering James Mielke says, “Very few manufacturers can integrate a top end dual-core application processor with a leading-edge modem. With the MSM8260 Qualcomm is showing real muscle by being the first in the world to do so.”

This teardown report reveals how efficient, from a cost and power perspective, a fully integrated solution can be.

Mielke continues, “Nvidia’s acquisition of ICERA earlier this year may show that it too believes the modem is has vital role to play in selling high end application processors in the current market.”

ABI Research’s “HTC Sensation Teardown includes all of the components in the MSM8260 chipset, the electrical bill of materials, measured performance numbers, and more.

The “Qualcomm MSM8260 Teardown is also available for purchase separately.

It is one of hundreds of devices and components – phones, baseband processors, power management, RF modules, connectivity components, application processors, sensors, and RF and power management discretes – that are torn down and analyzed in the firm’s Mobile Device Teardown Service.

ABI Research provides in-depth analysis and quantitative forecasting of trends in global connectivity and other emerging technologies. From offices in North America, Europe and Asia, ABI Research’s worldwide team of experts advises thousands of decision makers through 40+ research and advisory services. Est. 1990. For more information visit www.abiresearch.com, or call +1.516.624.2500.

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