A growing number of companies are competing with integrated baseband and application processor platforms (modaps). Only one semiconductor vendor has taken this one step further, adding wireless connectivity, so far but others will follow. An increasing number of surrounding components have been integrated as well, such as power management. Complete RF front ends will eventually become integrated also, as companies start to bring CMOS RF solutions to market. Reference designs are becoming increasingly important so OEMs, including tier one OEMs, can reduce time-to-market for mid-range devices.
This service is designed to keep clients abreast of the evolving mobile device semiconductor market as the industry dives deep into 4G with an eye on 5G; looks for what’s next after multi-core application processors; and looks to see just how many different functions and mobile and wireless technologies and bands can be crammed into a single SoC. Drawing on ABI Research’s extensive teardown analysis this service is able to give a unique perspective on the market.