Making the Impossible Possible: How CSPs Can Resolve Their Complicated Relationship with Manufacturers

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By Leo Gergs | 1Q 2020 | IN-5698


The Siemens/Qualcomm Joint Deployment Project


While the commercial deployment of 5G for consumer markets already picked up pace during 2019, the year 2020 will be decisive for the deployment of 5G on the factory floor, with manufacturers eagerly waiting for the freeze of the 3rd Generation Partnership Project (3GPP)’s release 16 (March 2020), which will enable industrial applications of 5G through the standardization of Time-Sensitive Networking (TSN), massive Machine -Type Communication (mMTC) and Ultra Reliable Low Latency Communication (URLLC).

Furthermore, the decisions of more and more national regulators to award local spectrum to enterprises directly will result in even more enterprises (like manufacturers) considering cellular network deployment.  

Against this background, in November 2019 industrial heavyweight Siemens announced 5G deployment at its automotive show room and test center in Nuremberg in a joint effort with chipset vendor Qualcomm. Even though this deployment project focusses on bringing 5G to the Nuremberg test center factory floor, it is Siemens’ clear ambition to extend…

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