Teardown Report: Basis B1

Based on findings from ABI Research’s Teardown Services a new product line has been created to examine the inner workings of the quickly-growing wearable devices. In this report ABI Research studies the Basis B1 in four sections: parts, dismantling, boards, and a block diagram.

The parts section includes audio & power management, connectivity, sensors, multimedia, box content, electrical, and mechanical. Each group includes manufacturer, part number, description, ASP, package type and area, quantity, and number of dies.

The dismantling section contains high resolution images and x-rays of the battery, back housing, and LCD display.

The boards section includes high resolution, annotated diagrams of the front and back PCB, as well as board area assignments and full-board x-rays. Finally, the block diagram is color coded and illustrates the inner workings of the Basis B1.

  • 1. PARTS
  • 2. DISMANTLING
  • 3. BOARDS (INTERNAL)
  • 4. BLOCK DIAGRAM
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Research Information

Price
Starting at USD 4500
Publish Date
3Q 2014
Code
AN-1850
Research Type
Technology Analysis Report
Pages
11