Intel and Rockchip Partner for SoC + 3G Solution

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2Q 2014 | IN-1019346

Accelerating the Integration of Intel Architecture in China


Intel has announced a partnership with SoC-maker Rockchip to develop a SoC + 3G solution based on Intel’s SoFIA technologies. The Rockchip-marked chipset is expected to be commercialized during the first half of 2015.

Most known for its dominance of the PC processor market, Intel has evolved its capabilities to offer a broader range of processors to address applications, including its Atom line for mobile devices. In communications, Intel currently offers XMM 7160, its first LTE Cat4 modem chipset, which has been deployed in Samsung’s Galaxy Note 3 Neo, Galaxy Tab 3 LTE, and ASUS Fonepad 7. XMM 7260, the next-generation LTE chipset capable of reaching 300 Mbps broadband speed (twice that delivered by XMM 7160), remains on track for this quarter according to Intel’s CEO Brian Krzanich, with commitments from ASUS, Dell, Lenovo, and Samsung to build it into devices and systems. Embedded modem modules will also be availa...

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