INDEX

Combo Connectivity Chipsets: Wi-Fi, Bluetooth, GPS, NFC, and UWB

The combination connectivity chipsets market combines various short range and other wireless standards into a single-die chipset. This approach offers both advantages and disadvantages. Stand-alone chipsets are still found in the market, and have been the starting point for the combination chipsets. Many companies combine various stand-alone chipsets to provide multi standard solutions which directly compete with combo chipsets.

This study focuses on Bluetooth, Wi-Fi, GPS, NFC, and UWB technologies, and will provide insight on their market trajectories and their makers' and users' future plans. It includes forecasts, and discusses the advantages and disadvantages of using single-die combo chipsets, multi-die combo solution packages, and standalone chips. Key company profiles are included.

Table of Contents

  • Executive Brief: Top-Line Forecast
  • 1. Executive Summary
    • 1.1. Combo Chipset Environment
    • 1.2. Market Drivers for Combo Chipsets
      • 1.2.1. More Wireless Standards in a Smaller Chip
      • 1.2.2. Applying Combo Chipset Software and Hardware Advancements to Standalone Solutions
      • 1.2.3. Bill of Materials
    • 1.3. Market Barriers for Combo Chipsets
      • 1.3.1. Timeframe of Relevance
      • 1.3.2. Chipset Design Constraints
      • 1.3.3. Device Designers Using Previous Solutions
    • 1.4. Recommendations for Chipset Manufacturers
    • 1.5. The Mobile Handset Market
  • 2. Technology Issues
    • 2.1. Interference between Wi-Fi and Bluetooth
    • 2.2. Design Issues
    • 2.3. Power Constraints
    • 2.4. Constantly Changing Wireless Standards
  • 3. COMPETITIVE LANDSCAPE
    • 3.1. Chipset Manufacturers
      • 3.1.1. Atheros Communications Inc
      • 3.1.2. Broadcom
      • 3.1.3. Texas Instruments
      • 3.1.4. ST-Ericsson
      • 3.1.5. MediaTek Inc
      • 3.1.6. Marvell Technology Group Ltd
      • 3.1.7. Qualcomm Incorporated
      • 3.1.8. CSR
  • 4. Market Forecasts
    • 4.1. Bluetooth Standalone Chipset Shipment Forecasts
    • 4.2. Wi-Fi Standalone Chipset Shipments and Forecasts
    • 4.3. GPS Standalone Chipset Shipments and Revenue
    • 4.4. NFC Standalone Chipset Shipments and Revenue
    • 4.5. UWB Standalone Chipset Shipments and Revenue
    • 4.6. Bluetooth Low Energy Single-Mode Shipments and Revenue
    • 4.7. Bluetooth Combo Chipset Shipments and Revenue
    • 4.8. Wi-Fi Combo Chipset Shipments and Revenue
    • 4.9. GPS Combo Chipset Shipments and Revenue
    • 4.10. Bluetooth Low Energy Dual-Mode (RF Only) Shipments and Revenue
    • 4.11. UWB Combo Shipments and Revenue
    • 4.12. Total Bluetooth Chipsets and Revenue
    • 4.13. Total Wi-Fi Chipset Shipments and Revenue
    • 4.14. Total GPS Chipsets Shipments and Revenue
    • 4.15. Total NFC Chipset Shipments and Revenue
    • 4.16. Total UWB Chipset Shipments and Revenue
    • 4.17. Single-Mode Chipset Shipments and Revenue
    • 4.18. Combo Chipset Shipments and Revenue
    • 4.19. Combo and Standalone Chipset ASPs
    • 4.20. Combo and Standalone Chipset Shipments
    • 4.21. Combo and Standalone Chipset Revenue
  • 5. Company Directory
  • 6. Acronyms
  • Table 4-1, Bluetooth Standalone Chipset and 'Bluetooth + BLE' Shipments and Revenue, World Market, Forecast: 2009 to 2015

Charts

  1. Combo and Standalone Chipset Shipments World Market, Forecast: 2009 to 2015
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Research Information

  • Price Log in to view pricing
  • Publish Date 3Q 2010
  • Research Type Research Report Report
  • Code RR-COMBO-10
  • Pages 38
  • Tables 50
  • Charts 2
  • File Formats Excel PDF Powerpoint