China Star A3 Teardown

Phone Teardown

The Star A3 contains a chipset that is sure to be one of the leading HSPA chipsets for 2012. The integrated application processor is not the most powerful, but it provides a good price and performance value. This report details the estimated cost and measured performance for the phone. The complete teardown includes high resolution photos of each of the chips, dismantling photos, unique board shots, performance measurements, a block diagram, cost information, and board area data.
  • China Star A3 Teardown
  • Specifications
  • Dismantle Photos
    • 8 High-Resolution Photos
  • Board Photos
    • 8 High-Resolution Photos
  • Power Measurements
  • Block Diagram
  • Parts List / EBOM
  • Baseband,Application Processor,Power Management
    • 1 teardown containing 9 High-Resolution Photos
  • Connectivity
    • 2 teardowns containing 16 High-Resolution Photos
  • Memory
    • 1 teardown containing 7 High-Resolution Photos
  • PM Discrete
    • 1 teardown containing 7 High-Resolution Photos
  • RF
    • 1 teardown containing 5 High-Resolution Photos
  • RF Front End
    • 8 teardowns containing 47 High-Resolution Photos
  • Sensor
    • 1 teardown containing 9 High-Resolution Photos