Practice Areas
- Internet of Everything
- Mobile Devices
- Cloud & Mobile Applications
- Enterprise Cloud Services & Devices
- OTT & Multiscreen Video
- Connected Home
- Connected Vehicles & ITS
- Location Technology
- Cyber Security
- ID, Smart Cards & Security
- Teardowns & IP
- Connectivity Technologies & Semiconductors
- Mobile Device Semiconductors
- RF Power Semiconductors
- Radio Access Networks & Backhaul
- Telco Software, Optimization & Monetization
- HetNets, Small Cells & Femto
- Mobile Carrier Benchmarks & Strategies
- Global Subscribers & Indicators
Product Information
Related Service
Related Research
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NEC: F1023 - microcontroller
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NUVOTON: NPCE698 - Microcontroller
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Motorola XT615 Teardown
Phone Teardown
This phone supports HSPA via an upgrade to one of the most popular chipsets in the industry from Qualcomm. The popularity comes from its low cost and more than adequate graphics performance, especially for a low-end smart phone. This report delivers the details about process technology, die sizes, power management, Bluetooth, WiLAN, GPS, and more. Tying it all together are unique board shots, performance measurements, benchmark data, cost information, and board area data.
- Motorola XT615 Teardown
- Specifications
- Dismantle Photos
- 10 High-Resolution Photos
- Board Photos
- 8 High-Resolution Photos
- Power Measurements
- Block Diagram
- Parts List / EBOM
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Baseband,Application Processor
- 1 teardown containing 8 High-Resolution Photos
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Connectivity
- 1 teardown containing 3 High-Resolution Photos
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Memory
- 1 teardown containing 9 High-Resolution Photos
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PM Discrete
- 6 teardowns containing 32 High-Resolution Photos
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Power Management
- 1 teardown containing 6 High-Resolution Photos
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RF
- 1 teardown containing 7 High-Resolution Photos
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RF Front End
- 10 teardowns containing 70 High-Resolution Photos
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Sensor
- 2 teardowns containing 16 High-Resolution Photos

