Practice Areas
- Internet of Everything
- Mobile Devices
- Cloud & Mobile Applications
- Enterprise Cloud Services & Devices
- OTT & Multiscreen Video
- Connected Home
- Connected Vehicles & ITS
- Location Technology
- Cyber Security
- ID, Smart Cards & Security
- Teardowns & IP
- Connectivity Technologies & Semiconductors
- Mobile Device Semiconductors
- RF Power Semiconductors
- Radio Access Networks & Backhaul
- Telco Software, Optimization & Monetization
- HetNets, Small Cells & Femto
- Mobile Carrier Benchmarks & Strategies
- Global Subscribers & Indicators
Product Information
Related Service
Related Research
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TOSHIBA: 1S203 - SP9T CMOS Antenna switch
RF Front End Teardown
-
TI: B5072A1 - PMU for intel processor
Power Management Teardown
-
WACOM: W8008 - Epen sensor controller
PM Discrete Teardown
-
NEC: F1023 - microcontroller
PM Discrete Teardown
-
NUVOTON: NPCE698 - Microcontroller
PM Discrete Teardown
Samsung Galaxy Y (S5360) Teardown
Phone Teardown
The Samsung Galaxy Y contains a chipset that is competing directly with Qualcomm's popular MSM7227. How does it compare in cost, board area, and power performance? The complete teardown includes high resolution photos of each of the chips, dismantling photos, unique board shots, performance measurements, a block diagram, cost information, and board area data.
- Samsung Galaxy Y (S5360) Teardown
- Specifications
- Dismantle Photos
- 9 High-Resolution Photos
- Board Photos
- 6 High-Resolution Photos
- Power Measurements
- Block Diagram
- Parts List / EBOM
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Baseband,Application Processor
- 1 teardown containing 7 High-Resolution Photos
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Connectivity
- 2 teardowns containing 13 High-Resolution Photos
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Memory
- 1 teardown containing 11 High-Resolution Photos
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PM Discrete
- 2 teardowns containing 12 High-Resolution Photos
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Power Management
- 1 teardown containing 6 High-Resolution Photos
-
RF
- 1 teardown containing 7 High-Resolution Photos
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RF Front End
- 10 teardowns containing 59 High-Resolution Photos
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Sensor
- 3 teardowns containing 26 High-Resolution Photos

