RIM BlackBerry Curve 9360 Teardown

Phone Teardown

The BlackBerry Curve continues to live. This model contains similar plastics and core suppliers to previous versions, but includes upgraded chips and features, like NFC, while still featuring the norm for BlackBerry designs. This report details the upgraded chips and all of the other components in the phone. The complete teardown includes high resolution photos of each of the chips, dismantling photos, unique board shots, performance measurements, a block diagram, cost information, and board area data.
  • RIM BlackBerry Curve 9360 Teardown
  • Specifications
  • Dismantle Photos
    • 12 High-Resolution Photos
  • Board Photos
    • 8 High-Resolution Photos
  • Power Measurements
  • Block Diagram
  • Parts List / EBOM
  • Application Processor
    • 1 teardown containing 5 High-Resolution Photos
  • Baseband,Application Processor
    • 1 teardown containing 7 High-Resolution Photos
  • Connectivity
    • 3 teardowns containing 18 High-Resolution Photos
  • Memory
    • 1 teardown containing 8 High-Resolution Photos
  • PM Discrete
    • 2 teardowns containing 4 High-Resolution Photos
  • Power Management
    • 2 teardowns containing 13 High-Resolution Photos
  • RF
    • 1 teardown containing 9 High-Resolution Photos
  • RF Front End
    • 12 teardowns containing 78 High-Resolution Photos
  • Sensor
    • 1 teardown containing 11 High-Resolution Photos