Practice Areas
- Internet of Everything
- Mobile Devices
- Cloud & Mobile Applications
- Enterprise Cloud Services & Devices
- OTT & Multiscreen Video
- Connected Home
- Connected Vehicles & ITS
- Location Technology
- Cyber Security
- ID, Smart Cards & Security
- Teardowns & IP
- Connectivity Technologies & Semiconductors
- Mobile Device Semiconductors
- RF Power Semiconductors
- Radio Access Networks & Backhaul
- Telco Software, Optimization & Monetization
- HetNets, Small Cells & Femto
- Mobile Carrier Benchmarks & Strategies
- Global Subscribers & Indicators
Microsoft Kin ONEm Teardown
Teardown
The Microsoft Kin was manufactured by Sharp. It was introduced in mid-2010, then taken off the market and released again later in the year, only to be taken off the market again a few months later. What is interesting about this phone, other than the odd life cycle, is that it uses an application processor not found in other phones. This report details this processor and all of the other chips in the phone. The complete teardown includes high resolution photos of each of the chips, dismantling photos, unique board shots, performance measurements, a block diagram, cost information, and board area data.
- Microsoft Kin ONEm Teardown
