Practice Areas
- Internet of Everything
- Mobile Devices
- Cloud & Mobile Applications
- Enterprise Cloud Services & Devices
- OTT & Multiscreen Video
- Connected Home
- Connected Vehicles & ITS
- Location Technology
- Cyber Security
- ID, Smart Cards & Security
- Teardowns & IP
- Connectivity Technologies & Semiconductors
- Mobile Device Semiconductors
- RF Power Semiconductors
- Radio Access Networks & Backhaul
- Telco Software, Optimization & Monetization
- HetNets, Small Cells & Femto
- Mobile Carrier Benchmarks & Strategies
- Global Subscribers & Indicators
Product Information
Related Service
Related Research
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TOSHIBA: 1S203 - SP9T CMOS Antenna switch
RF Front End Teardown
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TI: B5072A1 - PMU for intel processor
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WACOM: W8008 - Epen sensor controller
PM Discrete Teardown
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NEC: F1023 - microcontroller
PM Discrete Teardown
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NUVOTON: NPCE698 - Microcontroller
PM Discrete Teardown
Murata: SWd-GA508 - Duplexers, Saws, Peregrine SOS switches for BI, II, IV,V,VIII
RF Front End Teardown
This phone is highly publicized because it is one of the first design wins for the powerful NVIDIA processor. Qualcomm wins the main chipset, but it is not enough for this powerhouse new phone. The chipset is supported by additional power management and a new partition of chips from Qualcomm. This phone commands a close look, and many people will be surprised as to how this phone is put together. This report details the process technology, die sizes, power management, Bluetooth, WiLAN, GPS, and more. The complete teardown includes high resolution photos of each of the chips, unique board shots, performance measurements, cost information, and board area data.
- Murata: SWd-GA508 - Duplexers, Saws, Peregrine SOS switches for BI, II, IV,V,VIII
- Specifications
- Board Photos
- 11 High-Resolution Photos
