Palm Pixi Plus 3G Teardown

Phone Teardown

This phone supports HSPA via one of the most popular chipsets in the industry from Qualcomm. The popularity comes from its low cost and surprising graphics performance, especially for a low-end smartphone. This report delivers the details about process technology, die sizes, PA support, power management, Bluetooth, WiLAN, GPS, and more. The complete teardown includes high-resolution photos of each of the chips, along with unique board shots, performance measurements, cost information, and board area data.
  • Palm Pixi Plus 3G Teardown
  • Specifications
  • Dismantle Photos
    • 9 High-Resolution Photos
  • Board Photos
    • 8 High-Resolution Photos
  • Power Measurements
  • Block Diagram
  • Parts List / EBOM
  • Baseband,Application Processor
    • 1 teardown containing 6 High-Resolution Photos
  • Connectivity
    • 2 teardowns containing 12 High-Resolution Photos
  • Memory
    • 2 teardowns containing 15 High-Resolution Photos
  • PM Discrete
    • 4 teardowns containing 26 High-Resolution Photos
  • Power Management
    • 1 teardown containing 8 High-Resolution Photos
  • RF
    • 1 teardown containing 7 High-Resolution Photos
  • RF Front End
    • 9 teardowns containing 72 High-Resolution Photos
  • Sensor
    • 3 teardowns containing 20 High-Resolution Photos