Practice Areas
- Internet of Everything
- Mobile Devices
- Cloud & Mobile Applications
- Enterprise Cloud Services & Devices
- OTT & Multiscreen Video
- Connected Home
- Connected Vehicles & ITS
- Location Technology
- Cyber Security
- ID, Smart Cards & Security
- Teardowns & IP
- Connectivity Technologies & Semiconductors
- Mobile Device Semiconductors
- RF Power Semiconductors
- Radio Access Networks & Backhaul
- Telco Software, Optimization & Monetization
- HetNets, Small Cells & Femto
- Mobile Carrier Benchmarks & Strategies
- Global Subscribers & Indicators
Product Information
Related Service
Related Research
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TOSHIBA: 1S203 - SP9T CMOS Antenna switch
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TI: B5072A1 - PMU for intel processor
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WACOM: W8008 - Epen sensor controller
PM Discrete Teardown
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NEC: F1023 - microcontroller
PM Discrete Teardown
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NUVOTON: NPCE698 - Microcontroller
PM Discrete Teardown
ANAD: AWT6273 - BV WCDMA PA Help3
RF Front End Teardown
For 2G, a single chip is the way to go and many suppliers have shown it is the most economical solution. Take a look at this phone to see one of the latest single chip 2G solutions. Included in the report are detailed photos, process evaluations, and part descriptions for all of the major components such as the PA, power management, baseband processor, RF, Bluetooth, GPS, WiLAN, and many discretes. Tying it all together are the unique board shots, performance measurements, cost information, and board area data.
- ANAD: AWT6273 - BV WCDMA PA Help3
- Specifications
- Board Photos
- 8 High-Resolution Photos
