HTC Sensation 4G Teardown

Phone Teardown

HTC is one of the first phones to use the integrated dual-core application processor/HSPA modem from Qualcomm. While the performance may not be the best on the market, it is still satisfactory. This phone uses the same silicon area as the leading isolated dual-core application processor. Included in this report are detailed photos, process evaluations, and part descriptions for all of the major components such as the PA, power management, baseband processor, RF, Bluetooth, GPS, WiLAN, and many discretes. Tying it all together are the unique board shots, performance measurements, cost information, and board area data.
  • HTC Sensation 4G Teardown
  • Specifications
  • Dismantle Photos
    • 14 High-Resolution Photos
  • Board Photos
    • 8 High-Resolution Photos
  • Power Measurements
  • Block Diagram
  • Parts List / EBOM
  • Baseband,Application Processor
    • 1 teardown containing 9 High-Resolution Photos
  • Connectivity
    • 1 teardown containing 3 High-Resolution Photos
  • Memory
    • 1 teardown containing 11 High-Resolution Photos
  • PM Discrete
    • 7 teardowns containing 37 High-Resolution Photos
  • Power Management
    • 3 teardowns containing 19 High-Resolution Photos
  • RF
    • 1 teardown containing 7 High-Resolution Photos
  • RF Front End
    • 18 teardowns containing 109 High-Resolution Photos
  • Sensor
    • 4 teardowns containing 31 High-Resolution Photos