Practice Areas
- Internet of Everything
- Mobile Devices
- Cloud & Mobile Applications
- Enterprise Cloud Services & Devices
- OTT & Multiscreen Video
- Connected Home
- Connected Vehicles & ITS
- Location Technology
- Cyber Security
- ID, Smart Cards & Security
- Teardowns & IP
- Connectivity Technologies & Semiconductors
- Mobile Device Semiconductors
- RF Power Semiconductors
- Radio Access Networks & Backhaul
- Telco Software, Optimization & Monetization
- HetNets, Small Cells & Femto
- Mobile Carrier Benchmarks & Strategies
- Global Subscribers & Indicators
Product Information
Related Service
Related Research
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TOSHIBA: 1S203 - SP9T CMOS Antenna switch
RF Front End Teardown
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TI: B5072A1 - PMU for intel processor
Power Management Teardown
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WACOM: W8008 - Epen sensor controller
PM Discrete Teardown
-
NEC: F1023 - microcontroller
PM Discrete Teardown
-
NUVOTON: NPCE698 - Microcontroller
PM Discrete Teardown
Apple iPhone 4 C Teardown
Phone Teardown
The iPhone 4c supports CDMA only, but it uses a chipset that has far more capability. Is Apple setting it up so that it can maintain the same platform across all carriers? The application processor is the same as the one found in the AT&T version. The core modem chipset is from Qualcomm, which should not be a surprise for a US CDMA phone, but who won the supporting designs? This report details Apple's first departure away from AT&T. It also details the number of chips within the phone, the process technology, die sizes, PA support, power management, Bluetooth, WiLAN, GPS, and more. The complete teardown includes high-resolution photos of each of the chips, along with unique board shots, performance measurements, cost information, and board area data.
- Apple iPhone 4 C Teardown
- Specifications
- Dismantle Photos
- 13 High-Resolution Photos
- Board Photos
- 6 High-Resolution Photos
- Power Measurements
- Block Diagram
- Parts List / EBOM
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Application Processor
- 1 teardown containing 6 High-Resolution Photos
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Baseband,RF
- 1 teardown containing 9 High-Resolution Photos
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Connectivity
- 1 teardown containing 11 High-Resolution Photos
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Memory
- 3 teardowns containing 24 High-Resolution Photos
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PM Discrete
- 3 teardowns containing 19 High-Resolution Photos
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Power Management
- 2 teardowns containing 12 High-Resolution Photos
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RF Front End
- 5 teardowns containing 40 High-Resolution Photos
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Sensor
- 3 teardowns containing 18 High-Resolution Photos

