Huawei E173u Teardown

Teardown

Broadband modems are the first places new core access technologies are developed. Expectations of the E173u were for an entirely new chipset from a new supplier, but in fact only one of its chips made it into the chipset. This modem is a therefore a slight twist on a common chipset from the new supplier. This supplier is not small: it has the means to be significant.

This report provides a sneak peak at the portion of the new chipset from the new supplier. (When a modem or phone with the entire new chipset is available, it will also be reported.) This report offers details of process technology and die sizes; also PA, power management, Bluetooth, WiLAN and GPS support, and more. It also includes complete teardowns, including high resolution photos, of each of the chips. Unique board shots, performance measurements, cost information, and board area data are also provided.
  • Huawei E173u Teardown