Practice Areas
- Internet of Everything
- Mobile Devices
- Cloud & Mobile Applications
- Enterprise Cloud Services & Devices
- OTT & Multiscreen Video
- Connected Home
- Connected Vehicles & ITS
- Location Technology
- Cyber Security
- ID, Smart Cards & Security
- Teardowns & IP
- Connectivity Technologies & Semiconductors
- Mobile Device Semiconductors
- RF Power Semiconductors
- Radio Access Networks & Backhaul
- Telco Software, Optimization & Monetization
- HetNets, Small Cells & Femto
- Mobile Carrier Benchmarks & Strategies
- Global Subscribers & Indicators
Product Information
Related Service
Related Research
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PM Discrete Teardown
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NEC: F1023 - microcontroller
PM Discrete Teardown
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NUVOTON: NPCE698 - Microcontroller
PM Discrete Teardown
Mini XT Teardown (Chinese Contract Manufacturer)
Phone Teardown
ABI Research's series of teardown reports focuses on single-chip 2G chipsets and all 3G chipsets. This is a 2G phone with a single-chip solution. This is the first implementation of a single chip by an Asian manufacturer. This report enables comparisons with the other single chips available from European and US manufacturers.
This report offers details of process technology and die sizes; also PA, power management, Bluetooth, WiLAN and GPS support, and more. It also includes complete teardowns, including high resolution photos, of each of the chips. Unique board shots, performance measurements, cost information, and board area data are also provided.
This report offers details of process technology and die sizes; also PA, power management, Bluetooth, WiLAN and GPS support, and more. It also includes complete teardowns, including high resolution photos, of each of the chips. Unique board shots, performance measurements, cost information, and board area data are also provided.
- Mini XT Teardown (Chinese Contract Manufacturer)
- Specifications
- Dismantle Photos
- 20 High-Resolution Photos
- Board Photos
- 4 High-Resolution Photos
- Power Measurements
- Parts List / EBOM
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Baseband,RF,Power Management
- 1 teardown containing 7 High-Resolution Photos
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Connectivity
- 2 teardowns containing 13 High-Resolution Photos
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PM Discrete
- 1 teardown containing 6 High-Resolution Photos
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RF Front End
- 2 teardowns containing 15 High-Resolution Photos

