Practice Areas
- Internet of Everything
- Mobile Devices
- Cloud & Mobile Applications
- Enterprise Cloud Services & Devices
- OTT & Multiscreen Video
- Connected Home
- Connected Vehicles & ITS
- Location Technology
- Cyber Security
- ID, Smart Cards & Security
- Teardowns & IP
- Connectivity Technologies & Semiconductors
- Mobile Device Semiconductors
- RF Power Semiconductors
- Radio Access Networks & Backhaul
- Telco Software, Optimization & Monetization
- HetNets, Small Cells & Femto
- Mobile Carrier Benchmarks & Strategies
- Global Subscribers & Indicators
Product Information
Related Service
Related Research
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W301 Teardown (Chinese Contract Manufacturer)
Phone Teardown
This phone supports WCDMA and is implemented with a new chipset. Does this offering from a leading 2G supplier put them in a strong position for 3G? This report offers details of process technology and die sizes; also PA, power management, Bluetooth, WiLAN and GPS support, and more. It also includes complete teardowns, including high resolution photos, of each of the chips. Unique board shots, performance measurements, cost information, and board area data are also provided.
- W301 Teardown (Chinese Contract Manufacturer)
- Specifications
- Dismantle Photos
- 19 High-Resolution Photos
- Board Photos
- 4 High-Resolution Photos
- Power Measurements
- Parts List / EBOM
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Baseband
- 1 teardown containing 5 High-Resolution Photos
-
Connectivity
- 3 teardowns containing 21 High-Resolution Photos
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Power Management
- 1 teardown containing 9 High-Resolution Photos
-
RF
- 2 teardowns containing 12 High-Resolution Photos
-
RF Front End
- 3 teardowns containing 21 High-Resolution Photos
-
Sensor
- 1 teardown containing 7 High-Resolution Photos

