Samsung T559 (Comeback) Teardown

Phone Teardown

This phone supports HSDPA, but that is not unique. This implementation from Qualcomm is economical, efficient, and straightforward. Expect to see this implementation in more advanced solutions from Qualcomm in the future. From the start, Qualcomm claimed to be the first with a single-chip solution, but it has actually been a single package solution, not single-chip. This phone shows that they have taken a step forward to a true HSDPA single chip. This report offers details of process technology and die sizes; also PA, power management, Bluetooth, WiLAN and GPS support, and more. It also includes complete teardowns, including high resolution photos, of each of the chips. Unique board shots, performance measurements, cost information, and board area data are also provided.
  • Samsung T559 (Comeback) Teardown
  • Specifications
  • Dismantle Photos
    • 23 High-Resolution Photos
  • Board Photos
    • 6 High-Resolution Photos
  • Power Measurements
  • Parts List / EBOM
  • Baseband,RF,Power Management
    • 1 teardown containing 10 High-Resolution Photos
  • Connectivity
    • 1 teardown containing 3 High-Resolution Photos
  • Memory
    • 2 teardowns containing 13 High-Resolution Photos
  • PM Discrete
    • 3 teardowns containing 23 High-Resolution Photos
  • Power Management
    • 1 teardown containing 6 High-Resolution Photos
  • RF Front End
    • 5 teardowns containing 43 High-Resolution Photos