Practice Areas
- Internet of Everything
- Mobile Devices
- Cloud & Mobile Applications
- Enterprise Cloud Services & Devices
- OTT & Multiscreen Video
- Connected Home
- Connected Vehicles & ITS
- Location Technology
- Cyber Security
- ID, Smart Cards & Security
- Teardowns & IP
- Connectivity Technologies & Semiconductors
- Mobile Device Semiconductors
- RF Power Semiconductors
- Radio Access Networks & Backhaul
- Telco Software, Optimization & Monetization
- HetNets, Small Cells & Femto
- Mobile Carrier Benchmarks & Strategies
- Global Subscribers & Indicators
Samsung SGH-E2152 Teardown
Teardown
Samsung is one of the first to use this new chipset. Fresh out of the fabs in 2010, this new chip minimizes part count and provides good performance. This study presents all the details. Included in the report are detailed photos, process evaluation, and part discriptions for all of the major components such as PA, power management, baseband processor, RF, Bluetooth, GPS, WiLAN, and many discretes. Unique board shots, performance measurements, cost information, and board area data are also provided.
- Samsung SGH-E2152 Teardown
