RIM 9700 (T-Mobile Bold/Onyx) Teardown

Phone Teardown

RIM is still with its core partners for chipset platform development. Compare with the RIM 9000 to see the differences and similarities between these platforms separated by a few years. RIM is one of the few still making phones from the ground up without the help of complete chipsets or reference platforms from silicon vendors. This report shows all the details of RIM's solution.

This report offers details of process technology and die sizes; also PA, power management, Bluetooth, WiLAN and GPS support, and more. It also includes complete teardowns, including high resolution photos, of each of the chips. Unique board shots, performance measurements, cost information, and board area data are also provided.
  • RIM 9700 (T-Mobile Bold/Onyx) Teardown
  • Specifications
  • Dismantle Photos
    • 18 High-Resolution Photos
  • Board Photos
    • 4 High-Resolution Photos
  • Parts List / EBOM
  • Application Processor
    • 1 teardown containing 6 High-Resolution Photos
  • Baseband,Application Processor
    • 1 teardown containing 9 High-Resolution Photos
  • Connectivity
    • 3 teardowns containing 22 High-Resolution Photos
  • Memory
    • 1 teardown containing 6 High-Resolution Photos
  • Power Management
    • 3 teardowns containing 21 High-Resolution Photos
  • RF
    • 2 teardowns containing 12 High-Resolution Photos
  • RF Front End
    • 11 teardowns containing 90 High-Resolution Photos