Practice Areas
- Internet of Everything
- Mobile Devices
- Cloud & Mobile Applications
- Enterprise Cloud Services & Devices
- OTT & Multiscreen Video
- Connected Home
- Connected Vehicles & ITS
- Location Technology
- Cyber Security
- ID, Smart Cards & Security
- Teardowns & IP
- Connectivity Technologies & Semiconductors
- Mobile Device Semiconductors
- RF Power Semiconductors
- Radio Access Networks & Backhaul
- Telco Software, Optimization & Monetization
- HetNets, Small Cells & Femto
- Mobile Carrier Benchmarks & Strategies
- Global Subscribers & Indicators
Product Information
Related Service
Related Research
-
TOSHIBA: 1S203 - SP9T CMOS Antenna switch
RF Front End Teardown
-
TI: B5072A1 - PMU for intel processor
Power Management Teardown
-
WACOM: W8008 - Epen sensor controller
PM Discrete Teardown
-
NEC: F1023 - microcontroller
PM Discrete Teardown
-
NUVOTON: NPCE698 - Microcontroller
PM Discrete Teardown
Motorola Droid 2 Global (A956) Teardown
Phone Teardown
DROID Global supports HSPA and CDMA which is why it is called Global. Like most phones that support any form of CDMA, the core chipset is from Qualcomm. The company did introduce a new chipset partition with this chipset though, and many observers have not identified the components correctly. In addition, when released it was the most powerful phone in the world. Who provided that power?
This report offers details of process technology and die sizes; also PA, power management, Bluetooth, WiLAN, and GPS support, and more. It also includes complete teardowns, including high resolution photos, of each of the chips. Unique board shots, performance measurements, cost information, and board area data are also provided.
This report offers details of process technology and die sizes; also PA, power management, Bluetooth, WiLAN, and GPS support, and more. It also includes complete teardowns, including high resolution photos, of each of the chips. Unique board shots, performance measurements, cost information, and board area data are also provided.
- Motorola Droid 2 Global (A956) Teardown
- Specifications
- Dismantle Photos
- 21 High-Resolution Photos
- Board Photos
- 9 High-Resolution Photos
- Power Measurements
- Parts List / EBOM
-
Application Processor
- 1 teardown containing 7 High-Resolution Photos
-
Baseband,RF
- 1 teardown containing 9 High-Resolution Photos
-
Connectivity
- 1 teardown containing 6 High-Resolution Photos
-
Memory
- 3 teardowns containing 21 High-Resolution Photos
-
PM Discrete
- 2 teardowns containing 14 High-Resolution Photos
-
Power Management
- 2 teardowns containing 12 High-Resolution Photos
-
RF Front End
- 8 teardowns containing 67 High-Resolution Photos
-
Sensor
- 2 teardowns containing 11 High-Resolution Photos

