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Samsung GALAXY S II (GT-I8520) Teardown

ManufacturerSAMSUNGModelI9100; GALAXY S II
Announcement Date2/5/2011Air InterfaceHSPA
Operating SystemANDROIDTeardown CodeTD-1546

Samsung started from scratch with this phone, as almost every component is new: the Infineon modem, RFMD newly-architected PA, and Samsung's own dual-core processor. If you are looking to keep up with the latest technology, the Galaxy S II is a good place to start for 2011. Included in the report are detailed photos, process evaluations, and part descriptions for all of the major components such as the PA, power management, baseband processor, RF, Bluetooth, GPS, WiLAN, and many discretes. The complete teardown includes unique board shots, performance measurements, cost information, and board area data.

Included in this teardown:

  • Phone
    • I9100; GALAXY S II
      • Specifications
      • Dismantling Photos
        • 9 High-Resolution Images Sample
      • Boards Photos
        • 8 High-Resolution Images Sample
      • Power Measurements
        • 1 File
      • Block Diagram
        • 1 High-Resolution Image Sample
      • Parts List / EBOM
  • Platform Components
    • Baseband,Power Management
      • Specifications
      • Teardown Photos
        • 9 High-Resolution Images Sample
    • RF
      • Specifications
      • Teardown Photos
        • 5 High-Resolution Images Sample
  • Additional Components
    • Power Management
      • 1 teardown with 7 High Resolution Images
    • Connectivity
      • 4 teardowns with 33 High Resolution Images
    • Application Processors
      • 2 teardowns with 19 High Resolution Images
    • RF Front End
      • 3 teardowns with 39 High Resolution Images
    • Sensors
      • 4 teardowns with 31 High Resolution Images
    • PM Discretes
      • 12 teardowns with 81 High Resolution Images
    • Memory
      • 2 teardowns with 18 High Resolution Images
    • Memory
      • 2 teardowns with 18 High Resolution Images