Connectivity IC Integration in Mobile Devices and Mobile Computing

Bluetooth, FM Radio, GPS, Wi-Fi, WiMedia, NFC, Wibree

Device vendors are faced with the task of balancing the need for more features in products, with the conflicting forces of lower cost points, smaller form factors and longer battery life. As a result, OEMs continue to pile significant pressure on their silicon vendor partners to provide, smaller, lower-power and more cost-effective products. In highly competitive markets, IC integration offers silicon vendors the opportunity to meet OEM demands while still being able to maintain margins. This study profiles the market for different IC combinations across the important product segments of mobile computing and mobile devices.

What Questions Does This Report Answer?

  • What motivates silicon vendors to integrate ICs?
  • What IC combinations are likely to be integrated and why?
  • Which equipment markets are likely to see integrated ICs incorporated into system design?
  • What challenges lie in the path of IC integration?
  • What timelines are there for the introduction of integrated ICs?
  • What effect will integration have on the TAM for connectivity components?

Who Needs This Report?

  • Mobile device OEMs
  • Mobile computing OEMs
  • Connectivity IC vendors
  • GPS vendors
  • FM radio Rx IC vendors
  • Software suppliers.
  • Cellular chipset vendors.
  • ODMs