Report Code: RR-WMIC

Product Information

Number of Pages: 68

Number of Tables, Charts and Figures: 59

Deliverable Formats: PDF Document Excel Spreadsheet

Price: Login

Release Date: 3Q 2008

Brochure Download: Login

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07/15/2008:
Falling WiMAX Chipset Prices Spell Good News for Adoption of Smaller Mobile Devices

The WiMAX Chipset Market

Vendors, Market Issues, and Forecasts

The market for WiMAX chipsets is moving quickly with single-chip solutions appearing on the market and prices for baseband and RF ICs dropping fast. WiMAX chipset vendors are taking a variety of approaches to target base stations, CPE, laptops, and/or mobile devices with 2-chip, single-chip, 1X2, and 2X2 solutions. This study examines chipset vendors’ activities and products. It describes how rapid price declines will coincide with WiMAX chipsets being embedded into a wide variety of devices. Forecasts include shipments and revenue by a variety of segmentations including device CPE, mobile devices by type, region, main frequency band, and 802.16e/16m. ASP forecasts are broken down by baseband and radio frequency.

What Questions Does This Report Answer?

What products do WiMAX chipset vendors have on the market?
Which WiMAX chipset vendors are also working on LTE?
How fast will WiMAX chipset ASPs drop?
When will the market start moving from 802.16e to 802.16m?
What is the market for WiMAX chipsets in CPE?
What is the market for WiMAX chipsets in various mobile devices, including MIDs and consumer electronics?
What is the revenue opportunity for WiMAX chipsets?

Who Needs This Report?

WiMAX chipset vendors
WiMAX base station vendors
WiMAX CPE vendors
WiMAX-enabled mobile device vendors
Laptop vendors
Consumer electronics vendors
Handset vendors
MID vendors
Mobile operators
WiMAX service providers
Venture capitalists

1.1. Introduction
1.2. Market Forecasts
1.3. Market Dynamics
1.3.1. Major Drivers
1.3.2. Major Barriers
1.4. Suggestions for Chipset Vendors
2.1. Mobile WiMAX for Fixed and Mobile Use
2.1.1. WiMAX as a Fixed-Use Network
2.1.2. WiMAX as a Mobile Network
2.2. 4G Competitors
2.2.1. The Reason for 4G Networks
2.2.2. LTE
2.2.3. UMB
2.2.4. XG-PHS
2.2.5. The Misconceptions of Easy and Cheap LTE Upgrades
2.2.5.1. Myth 1: LTE Will Be a Software Upgrade from HSPA+
2.2.5.2. Myth 2: LTE Is Backwards-Compatible with GSM and WCDMA
2.2.6. The Prospect of LTE/WiMAX Harmonization
2.2.6.1. The Increasing Noise Around Harmonization
2.2.6.2. Mobile Wireless Chipset Activity
2.2.6.3. Benefit to the Mobile Ecosystem
2.2.6.4. Timing of the Realization of WiMAX/LTE Harmonization
2.2.6.5. IP Situations Will Hinder Harmonization
2.2.7. The Likely Scenario
2.3. State of the WiMAX Chipset Market
2.3.1. Single-Chip Baseband, Single-Chip RF
2.3.2. Digital Interface Between RF and Baseband chips
2.3.3. Single-Chip Baseband+RF
2.3.4. Process Technologies
2.3.5. Timing of 2X2 Versus 1X2 Products
2.3.6. WiMAX and Wi-Fi Combination Chipsets
2.3.7. WiMAX and LTE Combination Chipsets
2.4. WiMAX IP Situation
2.4.1. WiMAX Forum’s Hope of Controlling IPR
2.4.2. Open Patent Alliance
2.4.3. Qualcomm’s Position
2.5. Efforts Toward 802.16m
2.5.1. IEEE 802.16m
2.5.2. WiMAX Forum: WiMAX Releases 1.5 and 2.0
2.5.3. WiMAGIC
2.6. MIMAX: Low-Power WiMAX Standard
3.1. IEEE 802.16 Specifications
3.1.1. IEEE 802.16d: “Fixed” WiMAX
3.1.2. IEEE 802.16e: “Mobile” WiMAX Release 1
3.1.3. IEEE 802.16e: “Mobile” WiMAX Release 1.5
3.1.4. IEEE 802.16m: WiMAX Release 2
3.2. IEEE 802.16 Enhancements
3.2.1. IEEE 802.16f: Management Information Base
3.2.2. IEEE 802.16g: Network Management
3.2.3. IEEE 802.16h: License Exempt Networks
3.2.4. IEEE 802.16i : Mobile Management Information Base
3.2.5. IEEE 802.16j: Multi-Hop Relay
3.2.6. IEEE 802.16k: Bridging
3.3. WiMAX Forum Certifications and Timelines
3.3.1. Fixed WiMAX Certification
3.3.2. Mobile WiMAX Wave 1 Certification
3.3.3. Mobile WiMAX Wave 2 Certification
3.4. Benefits and Drawbacks of Smart Antenna Technologies
3.4.1. Multiple Input, Multiple Output
3.4.2. MIMO A
3.4.3. MIMO B
3.4.4. Uplink Collaborative MIMO
3.4.5. Beamforming
3.5. WiMAX Real-World Performance
3.6. WiMAX In-Building Coverage
3.6.1. Macro Base Station
3.6.2. Pico Base Station
3.6.3. Femtocells
3.7. Other Technology Issues
3.7.1. Spectral Mask / Guard Band and Device Implications
3.7.2. Frequency Re-Use
3.7.3. Interoperability
4.1. The WiMAX Chipset Vendors Poised to Lead
4.2. Note on Power Consumption
4.3. Consolidation on the Horizon
4.4. Vendor Comparisons
4.5. List of WiMAX Chipset Vendors
4.6. WiMAX Chipset Vendors Profiles
4.6.1. Altair Semiconductor
4.6.2. ApaceWave Technologies
4.6.3. ArrayComm
4.6.4. Beceem Communications
4.6.5. Comsys
4.6.6. DesignArt Networks
4.6.7. Freescale Semiconductor
4.6.8. Fujitsu Microelectronics
4.6.9. GCT Semiconductor Inc
4.6.10. Intel Corporation
4.6.11. MediaTek Inc
4.6.12. Motorola Inc
4.6.13. NextWave Wireless
4.6.14. NXP Semiconductors
4.6.15. picoChip
4.6.16. PMC-Sierra
4.6.17. Posdata
4.6.18. Qualcomm
4.6.19. Runcom Technologies Ltd
4.6.20. Samsung Electronics Co Ltd
4.6.21. Sequans Communications
4.6.22. Sierra Monolithics Inc
4.6.23. SiGe Semiconductor Inc
4.6.24. SyChip Inc
4.6.25. TeleCIS Wireless Inc
4.6.26. Texas Instruments Inc
4.6.27. Wavesat Inc
5.1. Market Forecast Methodology
5.2. Client Chipset Forecasts
5.2.1. CPE Chipset Forecasts
5.2.2. Mobile Device Chipset Forecasts
5.2.3. CPE and Mobile Device Chipset Forecasts
7.1. Base Station Chipset Forecasts