DSP in the Mobile Handset

Chipsets, Technologies, Market Drivers and Forecasts

This comprehensive study reviews the history of digital signal processing in the cellular handset, the evolution of DSP over the last decade, and the directions it will take in the next few years. It examines the trends that will affect DSP: cellular protocols, advanced multimedia, software-defined architectures, replacement of analog functions by digital, incorporation of multiple connective technologies such as Wi-Fi, GPS, Bluetooth, Ultrawideband, and WiMAX in the handset, and continued efforts to improve network link margins and voice quality.

It explains the differences between DSPs, microprocessors, ASICs, FPGAs and reconfigurable processors, and assesses whether the DSP is still the best solution for the job. Technology arguments such as the relative merits of VLIW, Superscalar, and SIMD are discussed. The study looks at the demarcations between the DSP, RF, and the applications in the mobile phone, and the integration trends towards System-in-Package and System-on-Chip. The research describes the MIPs required to implement GSM, GPRS, EDGE and 3G modems. DSP requirements based on handset manufacturers’ needs are analyzed, as well as requirements based on tier of handset and the air-interface. The business strategies of the various DSP vendors are revealed, along with the ASPs of the DSP baseband for the various cellular standards. Lastly, the report evaluates trends such as the single-chip cellphone and the ultra-low-cost handset segments, and their implications for the DSP.

Forecasts segment cellular handset shipments by region, by air-interface, and by handset-tier, and calculate DSP Baseband revenues.

What Questions Does This Report Answer?

  • What is the history of digital signal processing in the cellular handset?
  • How have DSP’s requirements changed over the last decade?
  • What trends will affect the mobile phone DSP in the next few years?
  • Can DSP’s place be taken by rival technologies such as the microprocessor, ASIC, FPGA or reconfigurable processor?
  • What are VLIW, Superscalar, and SIMD, and which architecture will predominate in the mobile phone?
  • How is partitioning between RF, DSP baseband and applications done in a handset?
  • What are the current integration trends for DSP?
  • How many DSP MIPs are required to implement the various air-interfaces such as 2G, 2.5G, 2.75G and 3G?
  • What DSP features are important for handset manufacturers?
  • What DSP requirements are mandated by the handset tier?
  • Who are the major DSP vendors, what are their business models and their technology differences?
  • What are DSP baseband ASPs for the different air-interfaces?
  • How do recent trends such as single-chip cellphones and ultra-low cost handsets affect DSP design?
  • What are the forecasts for DSP handset revenues to 2010?

Who Needs This Report?

  • IC and semiconductor vendors
  • PC Card and handset manufacturers
  • Infrastructure manufacturers
  • Software and firmware developers
  • Cellular operators