RF Power Amplifiers
Equipment and RF Power Device Analysis for Cellular and Mobile Wireless Infrastructure Markets
RF power amplifiers are integral parts of all base stations for cellular and mobile wireless infrastructure. They represent one of the most expensive component sub-assemblies in modern wireless infrastructure equipment, and both their performance and cost are important drivers in base station design. Efficiency, physical size, linearity and reliability are among the principal concerns. As price pressures become fiercer, new and innovative techniques and materials must be used to reduce the cost of this important component part while still maintaining performance. The RF power semiconductors used in these power amplifiers are the linchpin for their cost and capability, and they must keep pace with both the economic and technical realities facing designers and users of these RF power amplifiers.
This study examines all of the above topics and illuminates the interdependent relationship of RF power semiconductors to RF power amplifiers. Quantitative forecasts are presented through 2014 for both segments.
What Questions Does This Report Answer?
- What does the future hold for the RF power amplifier business?
- Will the merchant manufacturers get caught in the middle?
- Where are the OEMs?
- What performance criteria are driving future development?
- How will pricing pressures squeeze both users and vendors of RF power amplifiers?
- Which RF power device technology for RF power amplifiers will win?
- How will the RF power device dollar/watt curve drive the business?
- Will the market support the existing number of RF power device makers?
- Will Si LDMOS’s market domination continue?
- How does GaN fit into the picture?
- Are there new regional forces at play?
- Will China be a force in the RFPA marketplace?
- Will LTE be a RF power amplifier and device driver?
Who Needs This Report?
- Cellular infrastructure equipment manufacturers
- RF power amplifier OEMs and merchant market manufacturers
- RF power semiconductor manufacturers
- Semiconductor package suppliers
- Cellular and mobile service providers
- Potential market entrants

- 1.1. China Saves the Day
- 1.2. The Cost Issue Won't Go Away
- 1.3. Technology Implications
- 1.3.1. Technology Drivers for RF Power Amplifiers
- 1.3.2. Technology Drivers for RF Power Devices
- 1.4. Air Interface Implications
- 1.5. Suppliers
- 1.5.1. RF Power Amplifier Suppliers
- 1.5.2. RF Power Device Suppliers
- 1.6. Forecast Summaries
- 1.6.1. RF Power Amplifier Forecast
- 1.6.2. RF Power Device Forecast
- 1.7. What the Future Will Hold
- 2.1. Introduction to RF Power Amplifiers
- 2.1.1. Output Power Levels
- 2.1.2. Frequencies of Operation
- 2.1.3. Issues with Air Interfaces
- 2.1.4. Linearity Concerns
- 2.1.5. Efficiency Issues
- 2.1.6. A Few Words About WiMAX
- 2.1.7. Other Future RF Power Amplifier Trends
- 2.2. RF Power Amplifier Market Overview
- 2.2.1. Forecast Methodology
- 2.2.2. RF Power Amplifier Suppliers and Market Shares
- 2.3. RF Power Amplifier Market Analysis and Forecasts
- 2.3.1. RF Power Amplifiers by Output Power
- 2.3.2. RF Power Amplifiers by Frequency
- 2.3.3. RF Power Amplifiers by Air Interface
- 2.3.4. RF Power Amplifiers, Conventional versus High-Efficiency
- 2.3.5. RF Power Amplifiers Shipments and Revenue Forecasts
- 3.1. RF Power Devices
- 3.1.1. Silicon LDMOS
- 3.1.2. GaAs
- 3.1.3. SiC
- 3.1.4. GaN
- 3.1.5. Device Linearity Issues
- 3.1.6. Efficiency Concerns
- 3.1.7. Plastic Packaging
- 3.1.8. Industry Positioning
- 3.1.9. Future RF Power Device Trends
- 3.2. RF Power Amplifier Device Market Overview
- 3.2.1. Forecast Methodology
- 3.2.2. RF Power Amplifier Device Suppliers and Market Share
- 3.2.3. RF Power Amplifier Devices by Process Technology
- 3.2.4. RF Power Amplifier Devices by Package Type
- 3.2.5. RF Power Amplifier Devices, Conventional versus High-Efficiency
- 3.2.6. RF Power Amplifier Device $/W Implications
- 3.2.7. RF Power Amplifier Device Shipment and Revenue Forecasts
- 3.2.8. RF Power Amplifier Device Revenue by Device Forecast
- 4.1. Disruptive Market Forces at Work
- 4.2. Will GaN Finally Break into Mobile Wireless Infrastructure?
- 4.3. How Will LTE Change The RF Power Amplifier and RF Power Device Marketplace?
- 5.1. Alcatel-Lucent
- 5.1.1. Alcatel-Lucent Profile
- 5.1.2. Alcatel-Lucent Analysis
- 5.2. Andrew (Commscope, Inc)
- 5.2.1. Andrew (Commscope, Inc) Profile
- 5.2.2. Andrew (Commscope, Inc) Analysis
- 5.3. Ericsson
- 5.3.1. Ericsson Profile
- 5.3.2. Ericsson Analysis
- 5.4. Hitachi Kokusai Electric, Inc
- 5.4.1. Hitachi Kokusai Electric Profile
- 5.4.2. Hitachi Kokusai Electric, Inc Analysis
- 5.5. Huawei Technologies
- 5.5.1. Huawei Technologies Profile
- 5.5.2. Huawei Technologies Analysis
- 5.6. Motorola
- 5.6.1. Motorola Profile
- 5.6.2. Motorola Analysis
- 5.7. NEC Corporation
- 5.7.1. NEC Corporation Profile
- 5.7.2. NEC Corporation Analysis
- 5.8. Nokia Siemens Networks
- 5.8.1. Nokia Siemens Networks Profile
- 5.8.2. Nokia Siemens Networks Analysis
- 5.9. Nortel Networks
- 5.9.1. Nortel Networks Profile
- 5.9.2. Nortel Networks Analysis
- 5.10. Powerwave Technologies
- 5.10.1. Powerwave Technologies Profile
- 5.10.2. Powerwave Technologies Analysis
- 5.11. Wave Electronics Co, Ltd
- 5.11.1. Wave Electronics Co, Ltd Profile
- 5.11.2. Wave Electronics Co, Ltd Analysis
- 5.12. ZTE Corporation
- 5.12.1. ZTE Corporation Profile
- 5.12.2. ZTE Corporation Analysis
- 6.1. Beam Power Technology
- 6.1.1. Beam Power Technology Profile
- 6.1.2. Beam Power Technology Analysis
- 6.2. Ciclon Semiconductor (TI)
- 6.2.1. Ciclon Semiconductor (TI) Profile
- 6.2.2. Ciclon Semiconductor (TI) Analysis
- 6.3. Cree, Inc
- 6.3.1. Cree, Inc Profile
- 6.3.2. Cree, Inc Analysis
- 6.4. Eudyna Devices
- 6.4.1. Eudyna Devices Profile
- 6.4.2. Eudyna Devices Analysis
- 6.5. Freescale Semiconductor
- 6.5.1. Freescale Semiconductor Profile
- 6.5.2. Freescale Semiconductor Analysis
- 6.6. HVVi Semiconductors
- 6.6.1. HVVi Semiconductors Profile
- 6.6.2. HVVi Semiconductors Analysis
- 6.7. Infineon Technologies
- 6.7.1. Infineon Technologies Profile
- 6.7.2. Infineon Technologies Analysis
- 6.8. M/A-COM PHO
- 6.8.1. M/A-COM PHO Profile
- 6.8.2. M/A-COM PHO Analysis
- 6.9. Mitsubishi Electric
- 6.9.1. Mitsubishi Electric Profile
- 6.9.2. Mitsubishi Electric Analysis
- 6.10. Nitronex Corporation
- 6.10.1. Nitronex Corporation Profile
- 6.10.2. Nitronex Corporation Analysis
- 6.11. Nujira Ltd
- 6.11.1. Nujira Ltd Profile
- 6.11.2. Nujira Ltd Analysis
- 6.12. NXP Semiconductors
- 6.12.1. NXP Semiconductors Profile
- 6.12.2. NXP Semiconductors Analysis
- 6.13. PWRF, Inc
- 6.13.1. PWRF, Inc profile
- 6.13.2. PWRF, Inc Analysis
- 6.14. RFMD
- 6.14.1. RFMD Profile
- 6.14.2. RFMD Analysis
- 6.15. STMicroelectronics
- 6.15.1. STMicroelectronics Profile
- 6.15.2. STMicroelectronics Analysis
- 6.16. TriQuint Semiconductor
- 6.16.1. TriQuint Semiconductor Profile
- 6.16.2. TriQuint Semiconductor Analysis
Section 1.
Executive Summary
Section 2.
Cellular and Mobile Wireless Infrastructure RF Power Amplifiers
Section 3.
RF Power Devices For Cellular and Mobile Wireless Infrastructure
Section 4.
Disruptive Forces in RF Power Amplifiers and Devices for Cellular and Mobile Wireless Infrastructure
Section 5.
Vendor Profiles - RF Power Amplifiers
Section 6.
Vendor Profiles - RF Power Devices
Section 7.
Company Directory
Section 8.
Acronyms
Scope of Study
Sources and Methodology
Notes
