Near Field Communication Semiconductors

Silicon Solutions for Wireless Handset Contactless Technology



This study describes the increasing demand for Near Field Communication and the integrated circuits that drive this emerging technology in the cellular and wireless handset marketplace. The report provides a detailed examination of the NFC chipset and modem. It explains the requirements for competitive architectures, including essential product capabilities, and analyzes critical market constraints. The research identifies the wireless handset devices targeted by the NFC chipsets, explains the contactless payment hierarchy that currently exists (such as mobile commerce, banking, and security infrastructure), and examines both short- and long-term market implications. Key vendor profiles are included. The study concludes with an in-depth market forecast that numerically tracks the trends of both positive and negative market forces.


What Does This Report Answer?
• What key issues are yet to be tackled in seeing NFC integrated into mobile handsets?
• What is the NFC IC market size?
• How will NFC ICs help drive mobile commerce and contactless payments in wireless handsets?
• What are the major trends, market drivers, and product architectures in the NFC IC market?
• Who are the major players in the NFC IC market?
• What device technologies will NFC ICs affect?
Who Needs This Report?
• Handset manufacturers
• Wireless operators
• Wireless applications and services developers/vendors
• Contactless payment hardware vendors
• Contactless IC vendors
• RFID tag and inlay manufacturers




Section 1.
EXECUTIVE SUMMARY
1.1 Technology Synopsis
1.2 Market Assessment
1.3 Forecast Highlights

Section 2.
TECHNOLOGY OVERVIEW
2.1 NFC IC: Definition
2.1.1 Specifications
2.2 NFC Chipset and Modem
2.2.1 Integrated Circuits in Transponder Technology
2.3 NFC IC Security
2.4 NFC ICs and Handset Availability
2.5 Alternative Solutions/Similar Technology
2.5.1 Mobile FeliCa
2.5.2 U-SAM (Universal Secure Access Module)

Section 3.
MARKET ASSESSMENT
3.1 Market Environment
3.1.1 Wireless Connectivity IC Integration
3.1.1.1 NFC Integration with Bluetooth/Wi-Fi
3.2 The Security Element
3.2.1 NFC ICs and GSM
3.2.1.1 Standardized SIM Interface
3.2.2 NFC ICs and CDMA
3.3 Key Vendor Landscape
3.3.1 Inside Contactless
3.3.2 NXP Semiconductor
3.4 Regional Markets

Section 4.
MARKET FORECAST
4.1 Five Year Forecast
4.1.1 NFC Enabled Devices
4.1.1.1 NFC Enabled Handsets
4.1.2 NFC Chipsets
4.1.2.1 NFC Chipsets by Region
4.1.2.2 NFC Chipsets by Region by Handset Type

Section 5.
ACRONYMS
SOURCES AND METHODOLOGY
NOTES

Tables
  • Total NFC-Enabled Device Shipments , World Market, Forecasts: 2007 to 2012
  • NFC Chipset ASP , World Market, Forecasts: 2007 to 2012
  • Total NFC Chipset Revenue, World Market, Forecasts: 2007 to 2012
  • NFC Chipset Shipments by Region, World Market, Forecasts: 2007 to 2012
  • Wireless Handset Shipments by Phone Type, World Market, Forecasts: 2007 to 2012
  • NFC-Enabled Handset Shipments by Phone Type, World Market, Forecasts: 2007 to 2012
  • Total NFC Chipset Shipments, World Market, Forecasts: 2007 to 2012
  • NFC Chipset Shipments by Phone Type, Asia-Pacific Market, Forecasts: 2007 to 2012
  • NFC Chipset Shipments by Phone Type, North America Market, Forecasts: 2007 to 2012
  • NFC Chipset Shipments by Phone Type, Europe Market, Forecasts: 2007 to 2012
  • NFC Chipset Shipments by Phone Type, RoW Market, Forecasts: 2007 to 2012
Report Code: RR-NFCS

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Number of Pages: 25
Number of Tables, Charts and Figures: 12
Deliverable Formats:
Price: Login
Release Date: 3Q 2007


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Table of Contents:HTML
Related Press Releases:2008.01.04
2007.08.23


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