 Connectivity IC Integration in Mobile Devices and Mobile Computing
Bluetooth, FM Radio, GPS, Wi-Fi, WiMedia, NFC, Wibree
Device vendors are faced with the task of balancing the need for more features in products, with the conflicting forces of lower cost points, smaller form factors and longer battery life. As a result, OEMs continue to pile significant pressure on their silicon vendor partners to provide, smaller, lower-power and more cost-effective products. In highly competitive markets, IC integration offers silicon vendors the opportunity to meet OEM demands while still being able to maintain margins. This study profiles the market for different IC combinations across the important product segments of mobile computing and mobile devices.
What Does This Report Answer?
- What motivates silicon vendors to integrate ICs?
- What IC combinations are likely to be integrated and why?
- Which equipment markets are likely to see integrated ICs incorporated into system design?
- What challenges lie in the path of IC integration?
- What timelines are there for the introduction of integrated ICs?
- What effect will integration have on the TAM for connectivity components?
Who Needs This Report?
- Mobile device OEMs
- Mobile computing OEMs
- Connectivity IC vendors
- GPS vendors
- FM radio Rx IC vendors
- Software suppliers.
- Cellular chipset vendors.
- ODMs
Section 1.
Executive Summary
- 1.1 The Motivation for Integration
- 1.2 Conditions for Integration
- 1.3 End Markets Ripe for Integration
- 1.3.1 Cellular Handsets
- 1.3.2 Notebooks
- 1.4 What Technologies, When, and Where?
- 1.4.1 Timelines
- 1.5 Integrated IC Shipment Forecasts
Section 2.
Strategic Recommendations
- 2.1 Strategic Recommendations to End Equipment Vendors
- 2.2 Strategic Recommendations to Silicon Vendors
Section 3.
The Motivation for Integration
- 3.1 OEM Pressure
- 3.2 Competition
- 3.3 Volume
- 3.4 Technology and Standards Maturity
- 3.5 Power Saving
- 3.6 Diversification
- 3.7 Compelling and Definable Consumer Benefits
Section 4.
End Equipment Markets Ripe for Integrated Products
- 4.1 Conditions for Integration
- 4.2 Cellular Handsets
- 4.3 Notebooks
- 4.4 Others
Section 5.
The Nature and Types of Integration
- 5.1 Targeting End Markets with Tailored Integration
- 5.2 With the Host Processor
- 5.3 With Other Connectivity ICs
Section 6.
What Technologies, When, and Where?
- 6.1 Bluetooth + FM Radio
- 6.2 Bluetooth + GPS
- 6.3 Wi-Fi + Bluetooth
- 6.4 Bluetooth + UWB (WiMedia)
- 6.5 Bluetooth/Wi-Fi + NFC
- 6.6 Baseband/Host Processor + Bluetooth or Wi-Fi
- 6.7 Multi-Connectivity Solution Integration
- 6.8 Timelines
Section 7.
Market Forecasts
- 7.1 Short-Range Wireless Connectivity Integration in Cellular Handsets
- 7.1.1 Host Processor + Bluetooth
- 7.1.2 Bluetooth + FM Radio
- 7.1.3 Bluetooth + GPS
- 7.1.4 Bluetooth + Wi-Fi + FM Radio
- 7.1.5 Bluetooth + FM Radio + GPS
- 7.1.6 Bluetooth + WiMedia
- 7.1.7 Bluetooth + Wibree
- 7.1.8 Bluetooth + Wi-Fi + FM Radio + GPS + Wibree
- 7.1.9 Bluetooth + NFC
- 7.1.10 Bluetooth + Wi-Fi + FM Radio + GPS + Wibree + NFC
- 7.2 Short-Range Wireless Connectivity Integration in Mobile Computing
- 7.2.1 Host Processor + Bluetooth
- 7.2.2 Bluetooth + WiMedia
- 7.2.3 Bluetooth + Wibree
- 7.2.4 Bluetooth + Wi-Fi
- 7.2.5 Bluetooth + Wi-Fi + FM Radio + GPS + Wibree
- 7.2.6 Bluetooth + NFC
- 7.2.7 Bluetooth + Wi-Fi + FM Radio + GPS + Wibree + NFC
- 7.3 Integrated IC Shipment Forecasts
- 7.4 Compound Effect upon Connectivity IC Markets
Section 8.
Company List
Section 9.
Acronyms
Scope of Study
Sources and Methodology
Notes
Tables and Charts
- Handset Vendor Market Share 3Q 2006
- Integration Timelines
- Integration Timelines
- Integrated IC Shipment Volumes, World Markets: 2005 to 2011
- World Handset Shipments by Technology, World Markets: 2005 to 2011
- Cellular Handset Penetration by Air Interface, World Markets: 2005 to 2011
- GPS and FM Radio-Enabled Cellular Handset Shipments, World Markets: 2005 to 2011
- Wholesale ASP Trends, World Markets, 2004 to 3Q 2006
- Notebook and Mobile Computing Penetration by Air Interface Technology, World Markets: 2005 to 2011
- Cellular Handset Shipments by Integrated IC Type, World Markets: 2005 to 2011
- Notebook and Mobile Computing Shipments by Integrated IC Type, World Markets: 2005 to 2011
- Integrated IC Shipment Volumes, World Markets: 2005 to 2011
- Compound Effect on Connectivity IC Markets, World Markets: 2005 to 2011
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Number of Pages:
| 36 |
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Number of Tables, Charts and Figures:
| 10 |
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Deliverable Formats:
|   |
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Price:
| Login |
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Release Date:
| 1Q 2007 |
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