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DSP in the Mobile Handset Chipsets, Technologies, Market Drivers and Forecasts This comprehensive study reviews the history of digital signal processing in the cellular handset, the evolution of DSP over the last decade, and the directions it will take in the next few years. It examines the trends that will affect DSP: cellular protocols, advanced multimedia, software-defined architectures, replacement of analog functions by digital, incorporation of multiple connective technologies such as Wi-Fi, GPS, Bluetooth, Ultrawideband, and WiMAX in the handset, and continued efforts to improve network link margins and voice quality. It explains the differences between DSPs, microprocessors, ASICs, FPGAs and reconfigurable processors, and assesses whether the DSP is still the best solution for the job. Technology arguments such as the relative merits of VLIW, Superscalar, and SIMD are discussed. The study looks at the demarcations between the DSP, RF, and the applications in the mobile phone, and the integration trends towards System-in-Package and System-on-Chip. The research describes the MIPs required to implement GSM, GPRS, EDGE and 3G modems. DSP requirements based on handset manufacturers’ needs are analyzed, as well as requirements based on tier of handset and the air-interface. The business strategies of the various DSP vendors are revealed, along with the ASPs of the DSP baseband for the various cellular standards. Lastly, the report evaluates trends such as the single-chip cellphone and the ultra-low-cost handset segments, and their implications for the DSP. Forecasts segment cellular handset shipments by region, by air-interface, and by handset-tier, and calculate DSP Baseband revenues. What Does This Report Answer? What is the history of digital signal processing in the cellular handset? How have DSP’s requirements changed over the last decade? What trends will affect the mobile phone DSP in the next few years? Can DSP’s place be taken by rival technologies such as the microprocessor, ASIC, FPGA or reconfigurable processor? What are VLIW, Superscalar, and SIMD, and which architecture will predominate in the mobile phone? How is partitioning between RF, DSP baseband and applications done in a handset? What are the current integration trends for DSP? How many DSP MIPs are required to implement the various air-interfaces such as 2G, 2.5G, 2.75G and 3G? What DSP features are important for handset manufacturers? What DSP requirements are mandated by the handset tier? Who are the major DSP vendors, what are their business models and their technology differences? What are DSP baseband ASPs for the different air-interfaces? How do recent trends such as single-chip cellphones and ultra-low cost handsets affect DSP design? What are the forecasts for DSP handset revenues to 2010? Who Needs This Report? IC and semiconductor vendors PC Card and handset manufacturers Infrastructure manufacturers Software and firmware developers Cellular operators Scope of Study Sources and Methodology Notes Section 1 Strategic Overview 1.1 Digital Signal Processing in the Handset: Then and Now 1.2 Future Trends for the Mobile Phone DSP 1.2.1 Advance of Cellular Protocols to 3G and Beyond 1.2.2 Software-Defined and Software-Intensive Architectures 1.2.3 Replacement of RF and Analog Functions by Digital 1.2.4 Connectivity Technologies and Penetration Rates in the Handset 1.2.4.1 Wi-Fi 1.2.4.2 GPS 1.2.4.3 Bluetooth 1.2.4.4 Ultra Wideband 1.2.4.5 WiMAX 1.2.5 Continuous Improvement of Network Link Margins and Voice 1.3 Handset Makers’ DSP Requirements 1.4 DSP Shipments by Air Interface 1.5 DSP Handset Shipments by Tier 1.6 DSP Vendor Strategy and Business Models 1.7 DSP Vendors, and Their Handset OEM/ODM Customers 1.8 Major DSP Vendors and their Market shares 1.9 Pricing for Baseband DSPs 1.10 Ultra Low-Cost handset, its DSP, and its BOM 1.11 What Is Best for Digital Signal Processing in the Handset? 1.12 VLIW, Superscalar or SIMD: Does It Matter? 1.13 Demarcation Among the RF, DSP, Power Management, Memory, and Applications Sections 1.14 Standalone Versus Embedded DSPs 1.15 Integration Trends: System-in-Package or System-on-Chip 1.16 DSP MIPS in Today’s Handset Modems 1.17 Single Chip Cellphone 1.18 DSP IP Cores 1.19 Rival Technologies to DSP 1.19.1 ASICs 1.19.2 Configurable Processors 1.19.3 Microprocessors 1.20 ABI Research 12-Month Predictions for the Handset DSP Market Section 2 Technology 2.1 What is Digital Signal Processing? 2.2 Analog and Digital Signals 2.3 Digital Signal Processors 2.4 Applications of Digital Signal Processing 2.5 Digital Signal Processing Today Section 3 Forecasts 3.1 Forecasting Methodology 3.2 Wireless Handset Shipments 3.3 Wireless Handset Shipments by Tier 3.4 Wireless Handset Shipments by Air Interface 3.5 Baseband ASPs by Air Interface 3.6 Baseband Revenue by Air Interface Section 4 DSP Baseband Vendors 4.1 Agere Systems Inc 4.2 Analog Devices Inc 4.3 ARC International 4.4 ARM Ltd 4.5 Broadcom Corporation 4.6 CEVA Inc 4.7 Freescale Semiconductor 4.8 Infineon Technologies AG 4.9 Intel Corporation 4.10 LSI Logic 4.11 Morpho Technologies 4.12 Philips Semiconductors 4.13 QUALCOMM 4.14 Sandbridge Technologies 4.15 StarCore LLC 4.16 STMicroelectronics 4.17 Tensilica Inc 4.18 Texas Instruments 4.19 3DSP 4.20 TTPCom Appendix A Company Directory Agere Analog Devices ARC ARM Broadcom Ceva Freescale Infineon Intel LSI Logic Morpho Technologies Philips Semiconductors QUALCOMM Sandbridge Technologies StarCore STMicroelectronics Tensilica Texas Instruments 3DSP TTPCom Appendix B Acronyms List of Charts and Tables Wireless Handset Shipments, World Market: 2005 to 2010 Wireless Handset Shipment Share by Air Interface, World Market: 2005 Wireless Handset Shipments by Tier, World Market: 2005 to 2010 Baseband ASP by Air Interface, World Market: 2005 to 2010 Baseband Revenue by Air Interface, World Market: 2005 DSP Vendors and Their Handset OEM/ODM Customers Major DSP Vendors and Their Market Shares Ultra Low-Cost Handset Bill of Materials DSP Requirements of Cellular Standards Wireless Handset Shipments, World Market: 2005 to 2010 Wireless Handset Shipments by Tier, World Market: 2005 to 2010 Wireless Handset Shipments by Air Interface, World Market: 2005 to 2010 Baseband ASP by Air Interface, World Market: 2005 to 2010 Baseband Revenues by Air Interface, World Market: 2005 to 2010

Report Code: RR-DSPB Purchase this product Email this page Number of Pages: 44 Number of Tables, Charts and Figures: 9 Deliverable Formats: Price: Login Release Date: 4Q 2005 Brochure Download Login Table of Contents: HTML Download Related Press Releases: 2005.09.20 Research Report Power Management in Consumer Electronics Baseband Chipsets for 3G Multimedia Mobile Phones Micro-Electro-Mechanical Systems (MEMS) in Mobile Phones Application Processors in Mobile Devices

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