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3G Chipset Architectures for Video, Music, Gaming, and Television Market Trends, Applications, Operators, and Semiconductor Vendors This study describes the increasing traction of third generation cellular in the marketplace, in terms of the number of subscribers and the number of global operator deployments. The report provides a detailed examination of the services and applications that can be provided optimally only via 3G cellular services, such as mobile video, music, advanced gaming, imaging, videoconferencing and television. It explains the requirements for baseband chipset architectures that support the 3G cellular modem and its associated functions, and details 11 different baseband chipset vendors, comparing their solutions side-by-side in terms of modem performance, applications functions and features. Finally, the study outlines these vendors' technology roadmaps going forward from 3G to HSDPA and HSUPA. What Does This Report Answer? What is the status of 3G deployments worldwide? Why are operators deploying 3G, and what applications and services do they wish to offer? Why can't these services be offered over 2 and 2.5G cellular standards? What is the status of HSDPA trials and demos? Which applications from mobile video to music to television to gaming are most important to operators? How many baseband chipset solutions are there for 3G? What are the differences between these various solutions? What do the modem and the applications portions of these solutions look like? What does a side-by-side comparison of all these architectures reveal? How easy will it be for these vendors to upgrade to HSUPA? Who Needs This Report? Cellular semiconductor vendors ASIC, DSP and FPGA vendors in RF and baseband design Cellular handset vendors Cellular infrastructure vendors Software providers Operators Applications and content providers Scope of Study Sources and Methodology Notes Section 1 Strategic Overview 3G Mobile Applications and Chipset Implementations 1.1 3G Markets 1.1.1 Transitioning to 3G 1.1.2 Here Comes HSDPA 1.1.3 Can HSUPA Be Far Behind? 1.2 3G Applications 1.2.1 Mobile E-Mail, Instant Messaging, and Internet Browsing 1.2.2 Mobile Music and Audio 1.2.3 Multimedia Voice and Videoconferencing 1.2.4 Mobile Video 1.2.5 Video Capture and Messaging 1.2.6 Mobile Broadcast Television 1.2.7 Advanced Gaming, Graphics, and Pictograms 1.2.8 Digital Imaging and Mobile Postcards 1.2.9 FM Radio 1.2.10 Voice over Wi-Fi 1.2.11 Location-Based Services 1.2.12 Mobile Wallet 1.2.13 Business Applications 1.2.14 Ringback Tones 1.2.15 Ubiquitous Communications Section 2 Chipset Solutions and Evolution 2.1 UMTS/HSDPA Chipset Comparisons 2.1.1 Agere 2.1.2 Analog Devices 2.1.3 Broadcom 2.1.4 Ericsson Mobile Platforms 2.1.5 Freescale 2.1.6 Icera 2.1.7 Infineon 2.1.8 Interdigital 2.1.9 Philips Semiconductors 2.1.10 QUALCOMM 2.1.11 Texas Instruments 2.2 Implementation Philosophies 2.2.1 ARM7, ARM9, or ARM11 2.2.2 Diversity in the Receive Path 2.2.3 Single-Mode, Dual-Mode, or W-EDGE 2.2.4 FDD or TDD 2.2.5 Graphics 2.2.6 Integrating Bluetooth, Wi-Fi, GPS 2.2.7 Handset Memory 2.2.8 Handset Displays 2.3 UMTS and HSDPA: Gate Counts 2.4 UMTS and HSDPA: Die Areas 2.5 UMTS and HSDPA: MIPs 2.6 UMTS and HSDPA: Power Consumption 2.7 UMTS and HSDPA: Memory 2.7.1 Internal Memory 2.7.2 External Memory 2.7.2.1 Flash 2.7.2.2 RAM 2.8 UMTS and HSDPA: Frequency Bands 2.9 HSDPA Data Rates 2.10 3G Chipset ASPs, Shipments, and Revenue 2.11 3G Chipset Vendors and Their Customers 2.12 Vendor Market Share for 3G Chipsets: 2005 2.13 Which Chipset Vendor Will Win the 3G Race? Appendix A Company Directory Agere Analog Devices Broadcom Ericsson Mobile Platforms Freescale Icera Infineon Interdigital Philips Semiconductors QUALCOMM Texas Instruments Appendix B Acronyms Tables Chipset Details Applications Important to Operators Customers for 3G Chipset

Report Code: RR-3GCH Purchase this product Email this page Number of Pages: 26 Number of Tables, Charts and Figures: 3 Deliverable Formats: Price: Login Release Date: 1Q 2006 Brochure Download Login Table of Contents: HTML Download Related Press Releases: 2006.02.23 Research Report Mobile Phone Innovation in Japan and South Korea Application Processors in Mobile Devices Power Management in Consumer Electronics DSP in the Mobile Handset Mobile TV Handsets and Semiconductors

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